CALL 6 -STRENGTHENING TECHNOLOGY DEVELOPMENT IN SEMICONDUCTOR AND ELECTRONIC PACKAGING INDUSTRIES

THEME: ELECTRICAL AND ELECTRONICS / ADVANCED MATERIALS / PHYSICS / TECHNOLOGY

CALL: 

Universiti Sains Malaysia (USM) committed to strengthen Malaysia's semiconductor and electronic packaging sector, aligning with the National Semiconductor Strategy (NSS) 2024 and National Energy Transition Roadmap (NETR). In order to achieve this, expertise in materials science, electrical engineering, AI-driven manufacturing, and environmental sustainability must work together to address critical industry challenges while supporting Malaysia's transition to a high-value, sustainable electronics ecosystem.

Malaysia's semiconductor and electronic packaging industry stands at a critical juncture, facing significant challenges that threaten its global competitiveness and long-term sustainability. While the country has established itself as a major player in semiconductor assembly and testing, accounting for about 7% of global semiconductor exports, the industry remains largely concentrated in low-value, labor-intensive back-end operations. This reliance on traditional manufacturing processes leaves Malaysia vulnerable to shifting global supply chains and increasing competition from neighboring countries offering lower production costs.

The industry faces pressing technological gaps that hinder its progression up the value chain. Current packaging technologies are struggling to meet the demands of next-generation applications such as artificial intelligence, 5G/6G communications, and electric vehicles, which require advanced solutions like 3D IC integration and heterogeneous packaging. Thermal management has emerged as a critical bottleneck, with conventional materials failing to address heat dissipation challenges in increasingly miniaturized and powerful devices. 

Environmental sustainability presents another major challenge, as traditional semiconductor manufacturing remains energy-intensive and generates significant chemical waste. The industry lacks sustainable solutions for materials processing, waste reduction, and energy-efficient production methods. This is particularly concerning given Malaysia's commitments under the Paris Agreement and National Energy Transition Roadmap (NETR), which demand greener industrial practices. The growing problem of electronic waste further exacerbates these environmental concerns, with inadequate recycling infrastructure for end-of-life semiconductor products. 

Proposals should address one or more of the following interdisciplinary themes:

     1. Next-Generation Semiconductor Materials

• Development of wide bandgap semiconductors (e.g. SiC, GaN) for power electronics
• Advanced materials for IoT, 5G/6G, and AI applications

     2. Advanced Packaging Technologies

• 3D IC Integration and Heterogeneous packaging solutions 
• Thermal management and reliability enhancement

     3. Sustainable Manufacturing

• Green fabrication processes and circular economy approaches
• Energy-efficient production techniques

     4. Smart Manufacturing

• AI/ML applications for yield optimization and defect detection
• Digital twin technologies for semiconductor manufacturing 

Priority will be given to projects that foster multi-stakeholder collaboration, propose scalable solutions, and align with the National Semiconductor Strategy (NSS) 2024 and National Energy Transition Roadmap (NETR)

KEY RESEARCH AREAS

• This work requires a collaboration between those involve in research including (but not limited to) advanced materials development, device development, prototype development, artificial intelligence, and/or social impact of the technology

EXPECTED OUTCOME

1. Transdisciplinary research that leads to innovative solution semiconductor and electronic packaging 
2. A working prototype that can be tested on field
3. Possible wealth creation in terms of value-added products or business opportunities from the effective solution developed
4. Local approach to effectively address the problem with international relevance

TARGETED STAKEHOLDES

Targeted stakeholders that can benefit from the Outcome/Impact throughout this program

1. Semiconductor industries
2. Electronic packaging industries

2025-06-29 5:30:18 PM

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